The performance of solution-processed organic semiconductor devices is heavily influenced by the morphology of the active layer. Film formation is a complex process, with the final morphology being the result of the interplay between processing parameters and molecular properties, which is only poorly understood. Here, we investigate the influence of molecular stiffness by using two model oligomers, TT and CT, which differ only in the rotational flexibility of their central building block. We monitor absorption and emission simultaneously in situ during spin coating. We find that film formation takes place in four similar stages for both compounds. However, the time scales are remarkably different during the third stage, where electronically interacting aggregates are created. While this process is fast for the stiff CT, it takes minutes for the flexible TT. By comparing with previously determined aggregation properties in solution, we conclude that even though aggregate formation concurs with a planarization process, a certain amount of backbone flexibility is beneficial for establishing ordered structures during film formation. Here, the elongated time window in the case of the flexible compound can further allow for better processing control.